Manufacture of electronic part

電子部品の製造方法

Abstract

(57)【要約】 【目的】 素子及び素子に形成される電極の寸法が小さ い場合にも、タンポのような導電ペーストの印刷手段や カバーマスクなどに素子が付着、同伴することを防止し て、素子の外表面の少なくとも一つの面に電極が配設さ れた電子部品を効率よく製造する。 【構成】 素子3の、電極4a,4bが配設される面 (電極形成面)3aと反対側の面を、接着手段6を介し て保持治具5に接着することにより、素子3を保持治具 5上に保持させ、その電極形成面3aの所定の位置に電 極形成用の導電ペースト8を付与した後、素子3を保持 治具5上に接着、保持させた状態で、保持治具5ととも に焼成炉に入れて焼成し、導電ペースト8を焼き付ける とともに、接着手段6を分解させる。
PURPOSE: To enable an electronic part provided with, at least, an electrode located on one of its outer sides to be effectively manufactured by a method wherein the electronic part is restrained from adhering to or accompanying a conductive paste printing means such as a pad and a cover mask even if the part and the electrode are small in dimensions. CONSTITUTION: The side of an element 3 opposite to its side 3a where an electrode is provided is bonded to a holding jig through the intermediary of an adhesive means 6, whereby the element 3 is held on the holding jig 5, then conductive paste 8 is applied onto a prescribed spot on the electrode forming side 3a, the element 3 is bonded and held on the holding jig 5, introduced into a burning oven together with the holding jig 5, and burned to bake the conductive paste 8 and to decompose the adhesive means 6.

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